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XC7Z030-2FFG676I IC SOC CORTEX-A9 KINTEX7 676BGA Integrated Circuits ICs

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XC7Z030-2FFG676I IC SOC CORTEX-A9 KINTEX7 676BGA Integrated Circuits ICs

Model Number : XC7Z030-2FFG676I

Payment Terms : D/A, T/T, Western Union

Delivery Time : 1-2 work days

Packaging Details : Tape & Reel (TR)

RAM Size : 256KB

Package / Case : 676-BBGA, FCBGA

Packaging : Tray

Supplier Device Package : 676-FCBGA (27x27)

Number of I/O : 130

Speed : 667MHz

Lead Free Status / RoHS Status : Lead free / RoHS Compliant

Detailed Description : Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 275K Logic Cells 256KB 667MHz 676-FCBGA (27x27)

Flash Size : -

Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Moisture Sensitivity Level (MSL) : 4 (72 Hours)

Manufacturer Standard Lead Time : 10 Weeks

Core Processor : Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Primary Attributes : Kintex™-7 FPGA, 275K Logic Cells

Series : Zynq®-7000

Architecture : MCU, FPGA

Operating Temperature : -40°C ~ 100°C (TJ)

Peripherals : DMA

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We can supply XC7Z035-1FFG676I , send us a request quote to request XC7Z035-1FFG676I pirce and lead time.www.henkochips.com a professional electronic components distributor. With 10+ Million line items of available electronic components can ship in short lead-time, over 250 thousand part numbers of electronic components in stock for immediately delivery, which may include part number XC7Z035-1FFG676I.The price and lead time for XC7Z035-1FFG676I depending on the quantity required, availability and warehouse location.Contact us today and our sales representative will provide you price and delivery on Part XC7Z035-1FFG676I.We look forward to working with you to establish long-term relations of cooperation

RAM Size:	256KB	Package / Case:	676-BBGA, FCBGA
Packaging:	Tray	Supplier Device Package:	676-FCBGA (27x27)
Number Of I/O:	130	Speed:	667MHz
Lead Free Status / RoHS Status:	Lead Free / RoHS Compliant	Detailed Description:	Dual ARM® Cortex®-A9 MPCore™ With CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 275K Logic Cells 256KB 667MHz 676-FCBGA (27x27)
Flash Size:	-	Connectivity:	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Moisture Sensitivity Level (MSL):	4 (72 Hours)	Manufacturer Standard Lead Time:	10 Weeks
Core Processor:	Dual ARM® Cortex®-A9 MPCore™ With CoreSight™	Primary Attributes:	Kintex™-7 FPGA, 275K Logic Cells
Series:	Zynq®-7000	Architecture:	MCU, FPGA
Operating Temperature:	-40°C ~ 100°C (TJ)	Peripherals:	DMA

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